PL-800(ICP)Inductively coupled plasma etching machine has a wide range of applications in many fields, mainly including, in the field of electronics and communication technology can be used for silicon dioxide, strained silicon, silicon carbide, polysilicon gate structure, III-V compound and other semiconductor materials, as well as metal wire, metal welding pad and other metal materials. In the field of mechanical engineering, it is often used for deep groove etching of silicon materials, and shallow silicon etching in MEMS (micro-electromechanical system) surface technology. In addition, it also has potential application value in nanotechnology, biotechnology, optical technology and other fields.
